[‘20.07.08 Symposium] Symposium Packaging Integration Technology

1. Date : 2020 JULY 08 pm 1:00 ~ 5:00

2. Venue : Phoenix Pyeongchang Hotel 2nd Floor 3rd Session Hall (Agenda 4 Hall)

3. Schedule

1:00 – 1:15 / Introduction for KPIA and Semiconductor packaging integration technology center

1:15 – 1:30 / Introduction to PCB innovation center

1:30 – 2:20 / Package assembly-related package substrate technology trends

2:20 – 3:10 / Trend of surface mounting technology with electroless Ni-P surface finish

3:10 – 4:00 / Organic Semiconductor for Convergent Flexible Electronics

4:00 – 4:50 / Comprehensive review on oxide semiconductor and its applications

4. Inquary : E-mail. kpia.staff@gmail.com Tel. 070-8827-0777 Fax. 0504-375-7620