[‘20.05.22 Seminar] Advanced Packaging & Substrate / Standardization Seminar

1. Date : 2020 May 22 pm 12:30 ~ 3:10

2. Venue : ChungBuk TechnoPark convention hall

3. Schedule

1:00 – 1:50 Embedded Packaging Technology

1:50 – 2:40 Advanced Packaging Substrate Technology

2:40 – 3:10 International standard trends and importance of standardization

4. Inquary : E-mail. kpia.staff@gmail.com Tel. 070-8827-0777 Fax. 0504-375-7620