[ Packaging Integration Seminar ] 3D/SiP/AiP/Automotive module/MEMS/Sensor Packaging Technology

1. Date : November 6. 2019

2. Venue : KPU Art Center

3. Program
– 3D / SiP / AiP Technology
– Automotive module Packaging Technology
– MEMS / Sensor Packaging Technology

4. Inquiry: E-mail. kpia.jkc@gmail.com Tel. 070-8827-0777 (http://kpia-jkc.or.kr/)