[Packaging Integration Standard Expert Meeting]

1. Date : SEPTEMBER 2th 2020

2. Venue : Semiconductor Packaging Integration Technology Center Conference Room

3. Agenda :
① Report on the results of the project goals of the standard development cooperation organization in the first half
② Table of contents and contents consultation for preparation of TC91 activity report
③ Review and main contents of a total of 11 TC91 International Standards
④ Appointed as Chairman Lee Min-soo , IEC TC91 for electronic mounting technology
⑤ Appointed as Chairman Im Young-min of the Electronic Mounting Technology Business Association