[Packaging Integration Experts Workshop]

– Venue : Gyeongdo Resort

(September 26 pm)
– Artificial intelligent neuromorphic memory technology
– High Resolution Etching Resist Ink and Coverlay Ink Technology Trend
– Global and Korean PCB Industry Trends
– Latest semiconductor package technology trends
– Semiconductor Package FINAL TEST
– Package Board Technology Trend and Application

(September 27 am)
– Industry Experts and Technical Exchanges Technical Meeting
– Status of the Technology Support Center for Semiconductor Convergence Components