– LCG(Liaison_Coordination_Group) – mtg
– Korea, Europe, china, Japan 15 Experts
– 2021.02.04
– Venue : Zoom meeting
– General specification
– Temperature cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices
– Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices
– Power cycling test method and reliability performance index for die attach materials(near chip interconnection) applied to discrete type power electronic devices
– Temperature cycling test method and reliability performance index for die attach materials (system soldering interconnection)applied to discrete type power electronic devices