[KPIA Summer Seminar] Semiconductor Packaging Integration and Materials Technology Seminar 1. Date and time: July 15, 2022 (Fri) 10:00 ~ 17:00 2. Venue: Suwon Convention Center 202+203 3. Schedule: 10:00 – 10:50 / Substrate materials technology and market / Kaz Hirasaka, Senior Consultant, Prismark 11:00 – 11:50 / EV Power Semiconductor Module Packaging and Reliability / Professor Jeongwon Yoon, Chungbuk National University 1:00 – 1:50 / Trends in semiconductor package technology and material development / Youngkwan Koh, Managing Director, Samsung Electronics 2:00 – 2:40 / Power module technology for automotive / Shalu Agarwal, Dr. Analyst, Yole Development 2:50 – 3:40 / Technology trend of low-k resin for PCB / Seongbong Jang, group leader, Kolon Industries 3:50 – 4:40 / Fan-out wafer level package / Hyungjun Kim, Manager, Qualcomm Korea