[KPIA Symposium] Semiconductor Packaging Integration Technology Symposium

1. Date and Time: June 22, 2022 (Wednesday) 1:00 ~ 5:10 pm

2. Venue: Pyeongchang Alpensia Resort Daegwallyeong 2

3. Schedule:

1:00 – 1:10 / Introduction of semiconductor Packaging Integration technology and standard activities / President Kim Hyun-ho, KPIA

1:10 – 1:20 / Introduction of PCB Industry Innovation Center / Young-min Lim, Chief, KETI

1:20 – 1:30 / Introduction of Semiconductor Packaging Integration Technology Center / Team Leader Hong Kyung-jin, Chungbuk Technopark

1:30 – 2:00 / Research on photodetectors and memristors for neuromorphic electronic devices in future hardware-based artificial intelligence applications / Dr. Tarsoly Gergely, Chungbuk National University

2:30 – 3:00 / A study on semiconductor device performance of a-IGZO thin film transistor by ultrasonic treatment / Professor Kim Seong-jin, Chungbuk National University

3:00 – 3:30 / Packaging Integration Material/Technology Trend for Power Module Application for Electric Vehicles / Prof. Yuncheol Son, Chosun University

3:40 – 4:10 / Development of 5G AiP substrate for next-generation semiconductor package using ALD deposition AI203 thin film / Sang-Seok Cha, KPIR

4:10 – 4:40 / Slot die coater with pen type slot die head and etch module / Eundo Kim, CEO, The One Science

4:40 – 5:10 / 2-Layer Rt-QFN : Coreless board based on leadframe technology / Executive Vice President Byun Jeongsu, Haesung DS