[Mounting Technology Seminar] 5G&6G Communication Parts and Materials Mounting Technology Seminar

1. Date and time: October 28, 2021 (Thu) 9:30 ~ 17:20

2. Venue: Shilla Stay Cheonan

3. Schedule:

9:30 – 10:30 / Recent Trend of PCB Materials / Kaz Hirasaka, Prismark,

10:30 – 11:10 / Trend of resin for low-k material / Ho-Kyung Choi, Managing Director, ShinATNC

11:10 – 11:50 / Introduction of low-k PI adhesive material and ultra-thin PI FILM for high-speed transmission and high multi-layer, light, thin and small / Myung Beom-young, Director, Kukdo Chemical

13:00 – 13:40 / Journey to 6G / Senior Kim Sa-jin, Information and Communication Planning and Evaluation Institute

13:40 – 14:40 / Material trends for Advanced semiconductor packaging / Santoshi Kumar, Yole Development

14:40 – 15:00 / Chungcheongbuk-do Investment Attraction Briefing / Kim Jin-tae Team Leader, Chungcheongbuk-do

15:20 – 16:00 / Low-Loss Build-up Material for 5G and 6G Application / Takenori Kakutani, Taiyo Ink

16:00 – 16:40 / Latest low-k PCB material / CEO Kim Hak-cheol, Ventec Electronics

16:40 – 17:20 / Technology Trend of Connectivity Antenna for Vehicles / Jinkyu Hwang Research Fellow, Ace Technology