1. Date : 2020 JULY 08 pm 1:00 ~ 5:00

2. Venue : Phoenix Pyeongchang Hotel 2nd Floor 3rd Session Hall (Agenda 4 Hall)

3. Program
1:00 – 1:15 / Introduction for KPIA and Semiconductor packaging integration technology center
1:15 – 1:30 / Introduction to PCB innovation center
1:30 – 2:20 / Package assembly-related package substrate technology trends
2:20 – 3:10 / Trend of surface mounting technology with electroless Ni-P surface finish
3:10 – 4:00 / Organic Semiconductor for Convergent Flexible Electronics
4:00 – 4:50 / Comprehensive review on oxide semiconductor and its applications