[Seminar] Flexible Electronics Warpage, Au-free WLP, Die Embedding Packaging Technology

1. Date : July 4th
2. Venue : Chungbuk Techno Park
3. Program :
– Warpage Analysis of Flexible Electronics – KAIST
– Low Temperature Wafer Bonding Technology using Cu/Sn/Cu and Ni/Sn/Ni Sandwich Solder Syste – SAIT
– Die-embedded Packaging Technology – QUALCOMM Korea