[FOP, SiC, Packaging Technology Seminar]

1. Date : 2019 April 3rd pm 2:00 ~ 5:30

2. Venue : Chungbuk technopark Seminar room

3. Program
2:00 – 3:00 / Performance of Fan-out Package and Its Applications / NEPES
3:00 – 4:00 / SiC Power semiconductor Technology / ETRI
4:00 – 5:00 / Packaging Technologies For Harsh Environment / Samsung Electronic
5:00 – 5:30 / Q&A