<Advanced Electronic Mounting Technology and Market Seminar II>

1. Date: Thursday, October 26, 2023, 10:00 to 16:50

2. Location: COEX Room 308

3. Schedule:

10:00 – 10:40 / Advanced packaging technology trends / Director Park Seong-soon, Intel

10:45 – 11:25 / High Performance TIM for HPC and Data Center Semiconductor / Youngdo Kwon APD, Amkor

11:30 – 12:10 / Silver sinter technology and application / Managing Director Seongsik Kang, Heraeus

13:10 – 13:50 / Advanced Insulation Materials for Next Generation Package / Shiro Tatsumi Engineer, AJINOMOTO

13:55 – 14:35 / Mechanical drilling technologies for FC-BGA substrate cores / Yukiyoshi Hoshi General Manager, UNION TOOL

14:40 – 15:20 / Mobility platform preparing for future industries / Center Director Cheol-Woo Moon, KATECH

15:25 – 16:05 / Automotive smart antenna technology development trends / Managing Director Hwang Jin-gyu, ace antenna

16:10 – 16:50 / Driving forces and technology trends in advanced packaging / Senior Park Se-hoon, KETI