Advanced Electronics packaging integration Technology and Market Seminar II

1. Date: July 21, 2023 (Fri) 10:10 am - 17:00 am

2. Venue: Suwon Convention Center 401

3. Schedule:

10:10 – 11:00 / High frequency PCB materials market and technology trends /PRISMARK

11:10 – 11:50 / New Opportunities: Heterogeneous Integration and Chiplets / Seoul National University of Science and Technology

13:00 – 13:40 / Electronic Package Joint Reliability Technology Trend / Andong National University

13:50 – 14:30 / Next-generation electronic device technology based on AI semiconductors / Chungbuk National University

14:40 – 15:20 / Automotive reliability trend /  BOSCH

15:30 – 16:10 / Material research for advanced packaging technology/ Development status and CSIPOS activities / Fukuoka Uni

16:20 – 17:00 / Technology trends in high speed PCB materials / Shengyi Technology