Advanced electronics packaging integration technology and market seminar
1. Date: July 20, 2023 (Thursday) 10:10 am - 16:20 am
2. Venue: Suwon Convention Center 401
3. Schedule:
10:10 – 11:10 / Advanced packaging market and technology trend / Yole
11:20 – 12:00 / Glass precision processing technology trend for packaging / Joongwoo M-Tech
13:10 – 13:50 / Necessity of low-temperature soldering process and trend of low-temperature solder materials / MK Electronics
14:00 – 14:40 / FC BGA technology and market trend / AZ supply chain solutions
14:50 – 15:30 / Present and Future of Wafer Level Packaging for Advanced Sensors / Center Director, Institute of Advanced Nanotechnology
15:40 – 16:20 / Interconnect Reliability in Electronic Systems / Indium