Advanced electronics packaging integration technology and market seminar

1. Date: July 20, 2023 (Thursday) 10:10 am - 16:20 am

2. Venue: Suwon Convention Center 401

3. Schedule:

10:10 – 11:10 / Advanced packaging market and technology trend / Yole

11:20 – 12:00 / Glass precision processing technology trend for packaging / Joongwoo M-Tech

13:10 – 13:50 / Necessity of low-temperature soldering process and trend of low-temperature solder materials / MK Electronics

14:00 – 14:40 / FC BGA technology and market trend / AZ supply chain solutions

14:50 – 15:30 / Present and Future of Wafer Level Packaging for Advanced Sensors / Center Director, Institute of Advanced Nanotechnology

15:40 – 16:20 / Interconnect Reliability in Electronic Systems /  Indium