1. Date: June 21 (Wed) - 22 (Thu), 2023

2. Venue: Pyeongchang Alpensia Resort Daegwallyeong 2

3. Schedule:

June 21st (Wed)

13:20 – 13:50 / Novel Metalization Processes for Advanced Packaging Technologies / Professor Yoo Bong-young, Hanyang University

13:50 – 14:05 / 3D Printable Bi-Phasic Conductors by Surface-Conformal Laser Assisted Alloying Reactions / Jiyoon Shim, Researcher, Kyung Hee University

14:05 – 14:20 / Synthesis of functional organic-inorganic nanocomposite materials through surface treatment of nanoparticles / Professor Jeong Jae-han, Seoul National University of Science and Technology

14:20 – 14:35 / Underfill properties for the lifetime of BGA solder joints for electrical applications / Researcher Dajeong Kim, Korea Institute of Electronics Technology

14:35 – 14:50 / Cu@Ag paste low-temperature sintering pre-heating process for the next-generation power package / Wonmiso Research Institute, Korea Institute of Electronics Technology

14:50 – 15:05 / A Low-Dielectric and Degradable Adhesive for High-Frequency Electronic Devices / Boyoon Choi, Researcher, Sookmyung Women’s University

15:05 – 15:20 / Consideration of the technology trend of electronic mounting materials and the direction of the research meeting / Seongdae Park, Korea Institute of Electronics Technology

June 22 (Thu)

10:00 – 10:30 / Development of core parts for probe card for next-generation semiconductor pre-process inspection using AAO / Park Seung-ho, Managing Director, Point Engineering

10:30 – 10:45 / Millimeter Wave Band Electromagnetic Wave Absorbing Composite Material Using M-Type Ferrite / Lee Ho-rim, Korea Material Research Institute

10:45 – 11:00 / Light curing resin design and electrostatic chuck printing for electrostatic chuck production using 3D printing / Researcher Kim Moon-seong, Kongju National University

11:00 – 11:15 / Development and Optimization of 3D Printing Electrostatic Chuck Based on Ceramic Composite Resin with High Permittivity and Withstand Voltage Characteristics / Yujin Kim, Researcher, Kongju National University

11:15 – 11:30 / BaTiO3-PDMS Capacitive Hand Sign Language Sensor and Its Response Classification Using Machine learning / Researcher Frances, Kongju University

11:30 – 12:00 / EMC Technology for Electric Vehicles / Gong Byeong-seon, Managing Director, KCC