[KPIA Summer Seminar] Semiconductor Packaging Integration and Materials Technology Seminar
1. Date and time: July 15, 2022 (Fri) 10:00 ~ 17:00
2. Venue: Suwon Convention Center 202+203
3. Schedule:
10:00 – 10:50 / Substrate materials technology and market / Kaz Hirasaka, Senior Consultant, Prismark
11:00 – 11:50 / EV Power Semiconductor Module Packaging and Reliability / Professor Jeongwon Yoon, Chungbuk National University
1:00 – 1:50 / Trends in semiconductor package technology and material development / Youngkwan Koh, Managing Director, Samsung Electronics
2:00 – 2:40 / Power module technology for automotive / Shalu Agarwal, Dr. Analyst, Yole Development
2:50 – 3:40 / Technology trend of low-k resin for PCB / Seongbong Jang, group leader, Kolon Industries
3:50 – 4:40 / Fan-out wafer level package / Hyungjun Kim, Manager, Qualcomm Korea