협회활동
기술교류회
2025 JIC Conference, Singapore
관리자
2025-05-26
조회수 532
2025 JIC Conference, IEC Asia-Pacific Regional Centre, Singapore
JIC (Jisso International Council), 2025 Spring Meeting
May 26, 2025, IEC Asia-Pacific Regional Centre, Singapore
| Time | Country | Title | Speaker |
| Opening Session | |||
| 9:00-9:05 | JP | Opening Speech | Osamu Ikeda, Secretary, IEC TC 91 |
| 9:05-9:15 | SG | Welcome Greeting | Dennis Chew (or Suzanne Yap), IEC Asia-Pacific Regional Centre |
| JISSO Standardization Activities | |||
| 9:20-9:35 | US | Update on US Government Activity in Electronics Interconnection | Denny Fritz |
| 9:35-9:50 | KR | JISSO standardization activities in Korea | Hyunho Kim |
| 9:50-10:05 | CN | JISSO standardization activities in China | Zhongqiang Yang |
| 10:05-10:20 | JP | JISSO standardization activities in Japan | Masaki Suwa |
| 10:20-10:35 | DE | JISSO standardization activities in Europe | Walter Huck |
| 10:35-11:05 | Break Time | ||
| Technical Session | |||
| 11:05-11:35 | JP | Extremely Advanced Substrate as an integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) applications | Akihito Naito, Murata |
| 11:35-12:05 | KR | Standardization of Laser-Assisted Bonding Technology in Advanced IC Packaging | Minsu Lee, IEC TC 91 WG 5 Convenor |
| 12:05-13:35 | Lunch | ||
| 13:35-14:05 | SG | Advancing Singapore's Semiconductor Landscape: Opportunities, R&D Directions, and Collaborative Initiatives | Lim Yeow Kheng, National University of Singapore (NUS) |
| 14:05-14:35 | SG | Heterogeneous Integration and multi die chip assembly | Chong Chan Pin, Kulicke & Soffa |
| 14:35-15:05 | CN | Study on the qualification standard of void rate for reliable interconnection | Daojun Luo, The China Electronic Product Reliability and Environmental Testing Research Institute |
| 15:05-15:35 | Break Time | ||
| 15:35-16:05 | DE | Power Embedding for EV applications | Lars Böttcher, Fraunhofer IZM |
| 16:05-16:35 | DE | High voltage temperature-humidity-bias testing of electronic materials on the outer layer of a PCB – A Round Robin study and beyond | Lothar Henneken, Bosch (or Udo Welzel) |
| 16:35-16:45 | DE | Wrap and closing | Udo Welzel, Chair, IEC TC91 |
