2026 embedding Technology, Berlin, Germany (Hybrid)

Embedding 2026 - JISSO Information sharing forum (2026-01-19)

Chair person: Mrs. Tanja-san

Welcome at Fraunhofer IZM:  Mr. Rolf Aschenbrenner (General chair)

Greeting & Explanation on aim: Dr. Yoshihisa Katoh (co-General chair)

"Updated overview about Fraunhofer IZM”  by Mr. Rolf Aschenbrenner (Deputy Director of Fraunhofer IZM)

Speech 1: From Low-Loss Dielectric Resin Design to System Validation for High-Speed PCB & Advanced Packaging by Dr. Jyh-Long Jeng(ITRI, Taiwan) 

Speech 2: Fundamentals, Key Features, and Application Examples of Laser-Assisted Bonding Technology by Dr. Kwang-Seong Choi (ETRI, Korea)　

Speech 3: Approach to Advanced Heterogeneous Integration by Professor Jun Mizuno  (National Cheng Kung University, Taiwan)

Speech 4:"Cooling solutions for HPC and Chiplet packaging" by Mattis Obst (Fraunhofer IZM)

Speech 5:”Evaluation method of heat transfer for stacked electronic module   (the future IEC 62878-2-604)”  by Dr. Yoshihisa Katoh (Fukuoka University)

Speech 6:” Updated standardization activity on IEC TC91 including LCG/JIC    activities on Power module with new embedding technologies" by Mr. Walter Huck (DKE K682, IEC TC91) 

Speech 7:” Glass Substrate technology“ by Dr. Andres Ostmann (Fraunhofer IZM) 

The future activities in 2026  - IMPACT 2026 in Taipei on 2026 - Next meeting, Embedding 2027, in Berlin hybrid or web only on 2027 <TBD>