Monday, February 2

 Registration Opens

Plenary Session
Session Chair: Michael Konrad, Aqueous Technologies

Opening Remarks & Welcome
Mike Konrad, Conference Chairman

1:30pm-2:15pm

Arctic Sea Ice Instrumentation
Savannah Byron, Dartmouth College

High-Temperature Storage Stability of PFAS and
Non-PFAS Potting Materials Interfaces under High-G Applications
Pradeep Lall, Ph.D., Auburn University

Conditional Mechanistic Weight Edits:
Targeted Real-Time Hallucination Reduction in LLMs
Jane Lackley, Cornell University & Hayden Lee, Bergen County Academies

Decoding the Aging Immune System:
Multi-Omic Insights and the Promise of Precision Medicine
Jessica Lasky-Su, Ph.D., Harvard Medical School / Women's Hospital 

Welcome Reception

  Tuesday, February 3

Session 1: Reliability & Quality 1
Session Chair: 

Jugaad Engineering – The INEMI FOS Corrosion Chamber
Prabjit Singh, Ph.D., PJ Consulting

Additively Manufactured SIR for On-Part Testing
Jaime Regis, Ph.D. & Danielle Foster, KCNSC/Honeywell FM&T

A New Assessment of Multilayer Ceramic Capacitor Crack Severity
Theron Lewis, P.E. IBM Corporation

Session 2: Reliability & Quality 2
Session Chair:

Integrated Analysis of Lock-In Thermography, X-Ray Computed Tomography, and Scanning Electron Microscopy for
Rapid Screening and Characterization of Defects in High-Density Semiconductor Packages
Yuji Inui, Ph.D., Resonac Corporation

Recent Progress and Remaining Challenges in Solid-State Design for Safe Energy Storage
Sierra Freitas, Dartmouth College

Reliability of Cu-Wrap and Braided Column CGAs for Extreme Cold Applications
Michael Hart, Topline Corporation

Physics-Informed Machine Learning for Predicting IMC Growth in SAC305 Solder Joints under Thermal-Humidity Stress
Daryl Santos, Ph.D., Binghamton University

Session 3: Strategic Direction/Industry Roadmaps & Emerging Technologies
Session Chair: 

The Electron: A Biography
Ron Lasky, Ph.D., P.E., Indium Corporation

Understanding Technology Adoption Challenges in Manufacturing:
A Four-Year Longitudinal Analysis of U.S. SMMs
Ashley Yarbrough, Ph.D., Lipscomb University & Auburn University

Importance of Accreditation in Higher Education for the
International Comparability of Educational Qualifications
Kirsten Weide-Zaage, Leibniz Universität Hannover

High Resolution Additive Manufacturing: A New Tool for Advancing Electronics
Rebecca Gallivan, Ph.D., Dartmouth College

  Wednesday, February 4

Session 4: Korea Packaging Integration Association
Session Chairs: Yoonchul Son, Chosun University & Hyunho Kim, KPIA 

Compare Reliability of BGA Package with Different Soldering Processes:
Reflow Soldering vs IPL Soldering
Seung-Boo Jung, Sungkyunkwan University 

Cu/SiO₂ Hybrid Bonding: Dielectric Interface Strengthening and Cu Oxide Suppression
Sungdong Kim, Seoul National University of Science and Technology

EUV-Cut-Free Tip-to-Tip Shrink by Directional Ion-Beam Etching for BEOL Interconnects
Jongsoon Park, Sungkyunkwan University

Graphene-Based Multilayer Composites as a Promising Solution for Next-Generation EUV Pellicles
Yun Sung Woo, Dankook University

 Session 5: 3D Heterogeneous Integration & Nanotechnology
Session Chair:

Challenges With Large Area Ultra-High Density SIP
Jeffrey Kennedy, ZESTRON Corporation

Sintered Cu Paste as a Via-Filling Material for Through-Glass Via
Yoshinori Ejiri, Resonac Co., Ltd.

High Density Polymer RDL and Glass Core Interposers Based on a Plasma Dry Process for Scale-Up
Taku Hanna, Ph.D., ULVAC

Optimization and Qualification of Nano Thin-Film Coating for RF Sensitive Aerospace Assemblies
Nishant Trivedi, Hughes Network Systems

Session 6: Cleaning/Cleanliness Testing & Humidity Control
Session Chair:

Beyond the Golden Board: Real-World Evidence of Reflow Profile Temperature Drift and Residue Variability
Mike Konrad, Aqueous Technologies

Seeing the Invisible: A Non-Destructive Approach to Visualizing Flux Residues
Adam Klett, Ph.D., KYZEN Corporation

Adiabatic & Isothermal Humidification for Electronics Manufacturing:
The Science of Humidity Control in Manufacturing
Ryk Williams, Carel USA

Importance of Testing and Monitoring Different Types of Desiccants Used in the
Storage of Moisture Sensitive Devices Using Surface Insulation Resistance Methods
Terry Munson, Forsite Inc.

  Thursday, February 5

Session 7: Live Podcast Recording

Live Recording: The Reliability Matters Podcast Panel Discussion

AI in Action: Progress, Pitfalls, and the Future of Electronics
This panel will explore how AI is advancing manufacturing, the risks and workforce challenges that come with it, and the critical gaps where AI innovation is still needed. Join us for a concise, forward-looking discussion on where AI is helping, where it’s hurting, and where it must go next.

 Session 8: Reliability & Advanced Fabrication
Session Chair:

Effects of Aging on the Thermal Cycling Reliability of Ball Grid Array Assemblies
Jeffrey C. Suhling, Auburn University

From Fabric to Function: Textile-Based Sensors for Continuous Health Monitoring
Kaspar Jansen, TU Delft

Reliability Life Test of Additive Gravure Offset Electronics in Automotive Grade-3 Applications
Pradeep Lall, Ph.D., Auburn University

Session 9: Thermal Solutions & AI Inspection
Session Chair: 

Thermal Stress Finite Element Analysis of Carbon Foam Versus
Metallic Heat Sinks as a Thermal Management Solution for Integrated Circuits
Muhammad Ali, Ph.D., Ohio University

Chiplet Packaging and AI Defect Inspection
Charles Woychik, Ph.D., NHanced Semiconductors

Two-Phase Immersion-Cooled Data Centers
Charlie Polidoro, Inventec Performance Chemicals

12:30pm

Conferences Ends & Mai Tai Send-Off