<TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 1>

1.Date and Time: Wednesday, August 27, 2025, 10:00 AM - 5:00 PM

2. Venue: Suwon Convention Center, Rooms 202 and 203

3. Schedule:

10:00 – 10:50 / Market Trends in Advanced Semiconductor Packaging Technologies, Including Glass / Noh Geun-chang, Executive Vice President / Hyundai Motor Securities

11:00 – 11:40 / Glass Interposer and Glass Substrate Design Requirements / Lee Yong-sang, CEO / LPKF

11:40 – 11:55 / Introduction to Advanced Packaging Infrastructure and R&D Support / Jang Hee-jun, Senior Researcher / NATIONAL NANOFAB CENTER

13:10 – 13:40 / The Need for Glass Package Substrates and Core Technologies / Min Tae-hong, Lab Manager / SAMSUNG ELECTRO-MECHANICS

13:50 – 14:20 / Packaging technology towards reliable advanced semiconductors / Katsuaki Suganuma Prof. / OSAKA UNIVERSITY

14:30 – 15:00 / The Introduction to Thermal Interface Materials / Kang Seong-sik, Managing Director / Heraeus

15:10 – 15:40 / Trends in Advanced Packaging and Wiring Technology / Professor Kim Deok-gi / SEJONG UNIVERITY

15:50 – 16:20 / Transparent Electrode: Metal Grid & Conducting Oxide / Professor Kim Ji-hoon / KONGJU NATIONAL UNIVERSITY

16:30 – 17:00 / Co-Packaged Optics for Data Center 2025 / Martin Vallo Sr.Analyst / YOLE