– LCG(Liaison_Coordination_Group) 국제회의
– 2021.02.04 / Zoom meeting
– 참여 인원 : 15여명(한국2명, 일본 4명, 중국 2명, 유럽 6명, 미국 1명)
– General specification
– Temperature cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices
– Power cycling test method and reliability performance index for die attach materials applied to discrete type power electronic devices
– Power cycling test method and reliability performance index for die attach materials(near chip interconnection) applied to discrete type power electronic devices
– Temperature cycling test method and reliability performance index for die attach materials (system soldering interconnection)applied to discrete type power electronic devices