-TUESDAY, November 9

13:30-14:00 Characteristics of Low-Temperature Sn-58Bi Hybrid Solder / Jae Pil Jung, University of Seoul

14:00-14:30 Effects of Photosensitive Dielectric Process Conditions on the Interfacial Reliabilities of Cu RDL/Dielectric for Fan-Out Wafer Level Packaging /

Young-Bae Park, Andong National University

14:30-15:00 Secondary Batteries for Use in Industry and Regulations for Safety Issues / Bum Jong Kim, Korea Testing Laboratory

15:00-15:15 Demonstration of the Localization of Activity in the Brain Using a Self-Rectifying Memristor Array / Woon Hyung Cheong, KAIST

15:15-15:30 Heterosynaptic Oxide Thin-Film Transistor Using Hybrid Three- and Two-Terminal Charge Trap Memristors / Jae Bum Jeon,, KAIST

16:00-16:30 Novel Die Attach Materials and Processes for Power Devices / Hiroshi Nishikawa, Osaka University

16:30-17:00 Recent Research Trends on the Prediction and Reduction Method of RCS (Radar Cross Section) / Minseok Han, Republic of Korea Naval Academy

17:00-17:15 Inkjet Printing Technology for the Fabrication of OLED Devices / Sang-Ho Lee, KAIST

17:15-17:30 Investigation of Electromigration (EM) Failure in the Inkjet-Printed Ag Interconnected Lines / Prabhakar Jepiti, Kongju National University

-WEDNESDAY, November 10

09:00-09:30 Simultaneous Transfer and Bonding Process for Micro LED Display / Kwang-Seong Choi, ETRI

09:30-10:00 Strategies for Mechanically Reliable Thin-Film Flexible Electronics / Taek-Soo Kim, KAIST

10:00-10:15 Retention Secured Non-Linear and Self-Rectifying Analog Charge Trap Memristor for a Neuromorphic Application / Geunyoung Kim, KAIST

10:15-10:30 Low-Temperature Processed Conductive Pastes for Super-Durable Electrode Patterns / Ho Sun Lim , Sookmyung Women's University

13:30-14:00 Technology Trends in PCB Materials / Minsu Lee, KPIA

14:00-14:30 The Reactions between liquid Ga and Common Base Metals Used in Microelectronic Industry / Yoonchul Sohn, Chosun University