2018 LCG meeting

1. Attendees : KPIA Chairperson and 58 experts from 8 countries

2. Date : October 23, 2018

3. Venue : Busan, Korea

4. Agenda :

1) Confirmation of meeting minutes from 2018-08 

2) JIC presentation meeting in Busan (October 25) 

3) Status of short term projects

 3.1 Terminology, JISSO levels - terms of WG6 were proposed to WG5, IEC 60194-1 is now in CDV including the new terms

 3.2 TC91/WG6 projects (IEC 62878- series) - to be considered further for new projects(device embedded module) - WG6 generic specification, CDV 2018-11 submit - DEM NP will be submitted in Nov.(considering new numbering, system) - warpage project: Dr. Byun presented DTR at WG6. circulation early Nov. with members and SC47D(Yoshida) members - accelerated reliability test of microvia project: DTR should be circulated before WG6 meeting 

4) Liaison with TC40, SC47A, SC47D, TC 124 

- SC47A(integrated circuits): P-member 13EA(original 14EA), Liaison(TC91, TC40, SC47D), on-going project for three dimensional integrated circuits, new standard for LSI package board interoperable design, In-line thermal measurement of warpage by KR NC(similar to WG6 warpage project) other warpage projects are started at SC47D(IEC 60191-6-9) and TC91 WG6, information shall be shared within LCG group.

- TC124(Wearable electronic devices and technologies): two items are of interest; washability test(CD stage) and connectors for e-textiles(PWI stage) 

5) 3D structural electronics - injection molded sutructural electronics: TactoTek 

6) Next LCG/JIC meeting: Feb. 12, 2019, f2f meeting: May 23, 2019, Frankfurt 14:00