•2019 Fukuoka, Japan
-JISSO International Forum 2019(Japan)
-2019.11.27 ~ 11.29 Fukuoka, Japan
-Information Exchange on IEC TC91 WG6 Activities
– Updated status of IEC TC91WG6 activities
– Discussion on the new proposals
– IEC 62878-2-602: Evaluation method of inter module electrical connectivity
– IEC 62878-2-603: Evaluation method of intra module electrical connectivity
– the future IEC/TR 62878-2-9: Concept of JISSO level in the electronic assembly technology industries – The future plan
-2020-01-20 Meeting with Fraunhofer IZM and German National
Committee of IEC TC91 Discussion Theme?
Challenge items (& possible solutions at the next meeting after) to expand the market of Embedding technology, which would be one of items of Program.
– IEC TC91 WG6
– 2020-06-03 PM (13:30 – 17:00) in the week of 2020-06-01. Tokyo, Japan
– 2020-11 (in the week of 11-02) Helsinki, Finland
– International Forum
– 2020-04 Jisso International Forum in Fukuoka (Planned)
– 2020-10-21-23 IMPACT-ISMP 2020