Embedding
Technology International Forum in Berlin, Germany
1. Date :
January 17, 2022
2. Venue : Berlin, Germany (Hybrid : Online&offline)
3. Attendees
:
- Fraunhofer
IZM (DE)
- IEC TC91
German National Committee (DE)
- IEC
TC91 Japanese National Committee / METI Project / JIEP / JEITA (JP)
- Korea
Packaging Integration Association – JKC(Jisso Korea Council) (KR)
- TPCA /
ITRI (TW)
4. Agenda
- Status
and Progress of IZM Panel Level Consortium 2.0:
- Extreme
fine line horizontal and vertical routing for FOPLP
- State
of the art glass substrates for PLP, electro-optical boards and interposer
technology
- 3D
embedded substrate with cavity structure
- Latest
development status of EC2AMTM
- Evaluation
of Half-Bridge Power Module with POL-kW
- Updated
standardization activity on IEC TC91 including the future IEC 62878-2-9
(Concept of Jisso level)
- Updated
development status on the test method of electrical connectivity based on
knowngood-module (KGM) for the stacked electronic module