•2019 Berlin, Germany

– Embedding Technology

– 2019.01.12~ 01.19 Fraunhofer IZM Berlin Building 17, Room 060 Berlin, Germany
– Attendees: Fraunhofer IZM Rolf Aschenbrenner and 20 experts, 6 countries
– Largest Federal Ministry of Education and Research Project in the area of Microelectronics
– Setup of a virtual institute for the coordination of the cooperation partners inside the technology parks
– Investments in new machinery across the four technology parks:
– Silicon-based technologies, Compound semiconductors, Hetrointegration, Design, testing and reliability
– Introduction Fan-out Wafer and Panel Level Packaging – FOPLP technology background and standardization
– Status FOPLP: Carrier selection, Assembly, Compression Molding, RDL, Thinning, singulation, handling
– Cost modelling by IZM:
: Scope of cost modelling is advanced electronic packaging incl. PLP and WLP
: Cost modelling is simulating technology specific manufacturing process flows for high accuracy
: IZM’s generic cost modelling tool (software) can be parametrised with customer data
: High granularity of cost items including