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국제협력

국제실장위원회

2018 JIC Fremont, USA (JNAC)

관리자 2018-09-18 조회수 256
•2018 JIC# 19 Fremont, USA (JNAC)
– JIC (Jisso International Council)
– Date : 2018.05.13 ~ 05.20
– Fremont, USA
참석인원: 8개국 40여명
국가별 실장기술 표준화 동향 로드맵에 대해서 발표함.
– Fan-out PLP 기술동향, TC91에서 계속적인 중인 프로젝트를 발표함.
웨이러블 전자와 관련된 TC간의 협력현황 공유함.
일본 실장기술의 표준화 전략을 발표함.
– Terminology, JISSO level 관련하여 아래의 부분에 대한 용어를 WG5에서 논의되도록 용어를 정리하여 부산미팅에서 joint 미팅 진행 예정.
– TC91/WG6 projects (IEC 62878- series)
– WG6 title and scope has been changed into “Device embedding assembly technology”
– A new series of standards with different number shall be considered in preparation of Busan meeting to cover the new projects.
– IEC 62878-1: CD is circulated, deadline for comments is May 18th.
– Device embedded module: Interface and relation to TC 47 &SC 47A and SC 47D to be clarified, a joint project is needed. NP draft is scheduled for discussion at Busan meeting in October.
– Warpage: Describe method as TC91 TR, SC47D can share and discuss applicability for product standards. DTR will be produced. Also Fraunhofer confirmed, that measuring method and definition of warpage is very important issue. To be followed up with Korea.
– Accelerated reliability test of microvia: Will be reconsidered to be applicable as a screening test. TR is under preparation and draft will be issued by end of May.
다음글
2019 JIC Frankfurt, Germany (JEC)
이전글
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