The Korea Packaging Integration Association is holding an online seminar for the Jisso International Council (JIC).
Interested members are encouraged to apply. (First-come, first-served 50 people)

※Please check whether you are a JIC member or KPIA member before registering (You can ask KH Lee via sending an email to khlee@kpia-jkc.or.kr) => Zoom link is sent after member confirmation

JIC Conference registration – Time : 06.07.2021 8pm~11pm

20:00-20:05/5′ KNC – Opening Hyunho Kim / KPIA-JKC

20:05-20:30 /25′ JNC 1 JEITA Jisso Activities in Japan Ryoji Ninomiya / Toshiba Electronic Devices & Storage Corporation

20:30-20:45/15′ JNC 2 Whisker and related JISSO Material in JEITA standardization Group Ichizo Sakamoto / S.C.L

20:45-21:15 /30′ KNC 3 Introduction and application of laser assisted bonding (LAB) Yoonchul Sohn / Chosun University

21:15-21:35 /20′ GNC 4 Advances and Challenges in Additively Manufactured Electronics (AME) Devices from design to data Jaim Nulman / NanoDimension

21:35-21:55 /20′ GNC 5 Disruptive approach in the design and tool chain of additively manufactured circuit boards Michael Schleicher / Semikron

21:55-22:10 /15′ JNC 6 Revision of IEC61760-3 Ed1 : “Surface mounting technology of through-hole reflow(THR)　soldering. ” and “Guidelines for through hole diameter design with solder paste surface printing method.” Chiko Yorita / Hitachi, Ltd

22:10-22:35 /25′ JNC 7 Changes in thermal management caused by progress in surface mount technology Takashi Fukue / Kanazawa institute of technology

22:35-22:40 /5′ GNC – Closing Udo Welzel / Robert Bosch GmbH