[‘21.04.22] Intelligent semiconductor technology seminar

1. Date : 2021 April 22 pm 1:00 ~ 5:00

2. Venue : COEX Conference Room 308

3. Schedule
(0) 1:00 – 1:10 / Greetings and introduction / Kim Hyun-ho, Chairman of KPIA

(1) 1:10 – 2:00 / Various Fan out Packaging Solution / Seongjin Park, Manager, ASM

(2) 2:10 – 3:00 / Trends of research on the growth of intermetallic compounds in solder joints and mechanical reliability / Prof. Yooncheol Son, Chosun University

(3) 3:10 – 4:00 / Advances in Package Substrates Manufactured by Reel to Reel Processes / Jungsoo Byun, Haesung DS

(4) 4:10 – 5:00 / Built-in Stress effects of IC package substrate’s layers on its warpage / Min Sung Kim, Daedeok Electronics