Activity
Seminar
[KPIA Summer Seminar] Semiconductor Packaging Integration Technology Seminar
관리자
2022-07-19
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[KPIA Summer Seminar] Semiconductor Packaging Integration Technology Seminar
1. Date and time: July 14, 2022 (Thursday) 10:00 ~ 17:00
2. Venue: Suwon Convention Center 202+203
3. Schedule:
10:30 – 11:00 / Super-gap packaging technology status and strategy / Chairman Seong-Hoon Jwa, Korea Microelectronics Packaging Research Association
11:10 – 12:00 / Embedded component package technology / Deputy Manager Ho Min Ho, AT&S Korea
1:00 – 1:50 / Advanced semiconductor packaging technology for automotive / Byung-Jin Kim, Chief, Amkor Technology Korea
2:00 – 2:50 / Advanced interconnection technologies in semiconductor packaging / Director Park Seong-soon, Intel Korea
3:00 – 3:50 / Test Trends of Packaging / Nagai Masashi Group manager, Advantest Korea
4:00 – 4:50 / Advanced semiconductor package including activities of Research Center for 3D semiconductors and IEC TC91 WG6 / Yoshihisa Katoh, Prof. , Fukuoka University
