[Packaging Integration Technology Seminar] Semiconductor Semiconductor Packaging Integration Technology Seminar
1. Date and time: July 30, 2021 (Fri) 10:30 ~ 16:20
2. Venue: Online Zoom
3. Schedule:
10:30 – 10:35 / Introduction / Kim Hyun-ho, President of the Association, Korea Chamber of Commerce Industry Association
10:35 – 11:20 / Recent Trend of Electronics Packaging and PCB Industry (Recording) / Brandon Prior, Prismark
11:20 – 12:05 / 5G Packaging Market and Technology Trends / Santosh Kumar, Yole
13:10 – 13:55 / Advanced Package Test Solutions / Advantest Korea. Nagai Masashi
13:55 – 14:40 / Au-Less, Ni-Less, Roughness-Less, Migration-Less PCB Cu Surface Treatment Using All-in-One AI2O3 Passivation / Park Soo-Jae Senior, Samsung Electronics
14:50 – 15:35 / Package substrate technology trends and challenges / Sang-Seok Cha, Head of Research Center, Korea Implementation Technology Research Institute
15:35 – 16:20 / Semiconductor high-integration packaging technology trend / Nepes, Managing Director Kang In-su