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Seminar

Symposium Packaging Integration

관리자 2021-09-13 Number of views 312

[‘21.6.30] Symposium Packaging Integration

1. Date and time: June 30, 2021 (Wednesday) 1:00 ~ 5:20
2. Venue: Pyeongchang Alpensia Resort Daegwallyeong 2
3. Schedule:
1:00 – 1:15 / Introduction of semiconductor fusion parts mounting technology and standard activities / President Kim Hyun-ho, KPIA

1:15 – 1:30 / Introduction of PCB Industry Innovation Center / Youngmin Lim, Chief, KETI

1:30 – 1:45 / Introduction of Semiconductor Convergence Parts Mounting Technology Center / Team Leader Hong Ki-baek, Chungbuk Technopark

1:50 – 2:30 / Research Trends for Growth Behavior and Mechanical Reliability of Intermetallic Compounds in Solder Joints / Prof. Yuncheol Son, Chosun University

2:30 – 3:10 / Quality status of domestic electronic products through defect analysis / Advisor Jinho Lee, KETI

3:20 – 4:00 / Vacuum deposition technology for latent fingerprints / CEO Kim Eun-do, The One Science

4:00 – 4:40 / Artificial intelligence integrated memory system using brain function simulation / Professor Kim Seong-jin, Chungbuk National University

4:40- 5:20 / Reusable battery industry and testing and certification status / Center Director Kim Beom-jong, Korea Testing and Research Institute